3C Electronics

To address industry demands in semiconductor packaging & testingchip mounting, and high-precision assembly of 3C components, the ultra-stable LRA series has been developed. Integrating cutting-edge technologies such as precise force control compensationsoft-landing technologyconstant-force magnetic springs, and high-resolution optical encoding, these products deliver robust support for advanced manufacturing and intelligent equipment. This technological breakthrough is set to accelerate progress in semiconductor equipmentconsumer electronics production, and precision machining, driving revolutionary advancements in smart manufacturing.

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