Precision Assembly & Smart Gripping Solutions for 3C Electronics
For manufacturing mobile phones, computers, and wearable devices, we provide high-precision, high-speed, and highly reliable smart gripping and assembly solutions to empower 3C automation upgrades.
Challenges in 3C Manufacturing
Fast Product Iteration
3C products evolve rapidly, requiring frequent line changeovers. Traditional fixturing is costly and slow to change, making it difficult to meet flexible production needs.
High Precision Requirements
Processes such as screen lamination and precision assembly require micron-level positioning accuracy. Traditional pneumatic grippers lack force-control precision and easily damage workpieces.
Fast Cycle Times
3C lines run at fast cycle times, demanding quick gripper response and short open/close times while maintaining stability and reliability for high-volume production.
Fragile Workpieces
Workpieces such as screens, chips, and glass are fragile and easily scratched, requiring precise force control that traditional grippers cannot deliver for delicate handling.
High Labor Costs
3C manufacturing is labor-intensive. With hiring difficulties and rising labor costs, manufacturers urgently need automation to replace manual labor and improve efficiency.
Compact Space
3C lines have limited space, so end-effectors must be small and lightweight to complete complex assembly tasks in tight working envelopes.
Core Advantages of Jodell's 3C Solutions
Micron-Level Precision
Repeatability of ±0.02 mm and force-control accuracy of 0.1 N meet the demands of high-precision processes such as screen lamination and precision assembly.
High-Speed Response
Open/close time as fast as 0.1 s and a 200 Hz response frequency meet high-speed 3C line cycles and boost throughput.
Gentle Force Control
Precise force control enables delicate gripping of fragile workpieces such as screens and chips, avoiding damage and raising yield to 99.9%.
Flexible Production
One gripper adapts to multiple workpieces; stroke and grip force are programmable for quick product changeover, suiting high-mix, low-volume production.
Compact Design
Small and lightweight, the thin design is only 16 mm thick, ideal for tight 3C line spaces and reducing robot payload.
Easy Integration
Supports major fieldbus protocols such as EtherCAT and Modbus, with adapter flanges for all major robot brands for fast deployment.
Typical Application Processes
Complete Phone Assembly
Precision assembly and handling of mid-frames, back covers, batteries, cameras, and other phone components.
Screen Lamination
Precision lamination and handling of phone, tablet, and watch screens; accurate force control prevents breakage.
Chip / PCB Handling
High-speed pick-and-place of chips, PCBs, and electronic components for SMT line applications.
In-Line Inspection
Workpiece loading/unloading and handling for visual inspection and functional test stations.
Connector Plug-In/Out
Precise plugging and unplugging of Type-C, FPC cables, and other connectors; force feedback confirms proper seating.
Packaging & Palletizing
Sorting, boxing, and palletizing of finished phones and accessories in downstream logistics.
Real Application Demonstrations
Official demo videos from Jodell Robotics, showcasing end-effector performance in real production lines across industries.
Circuit Breaker Assembly
Phone Component Handling
Electronic Component Gripping & Handling
3C Component Loading & Unloading
CNC Loading & Tool Changing
LRA Linear Rotary Actuator
Popular Products for the 3C Industry
EPG-HP High-Precision Series
Repeat accuracy ±0.02 mm, force-control accuracy 0.1 N, ideal for precision assembly and screen lamination.
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EPG-T Thin Series
Only 16 mm thick with a compact design for installation in tight spaces; ideal for electronic component handling.
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ERG Electric Rotary Gripper
Integrated gripping and rotation, ideal for rotary assembly, screw driving, and labeling processes.
View DetailsGet Your Dedicated 3C Industry Solution
Our industry experts will provide customized automation solutions to upgrade your production line.